Canon Nanotechnologies has led the development of advanced nanoimprint lithography (NIL) tools and technologies that have redefined the possibilities for high-resolution, low-cost patterning in semiconductor manufacturing. Beginning with the pioneering Imprio® series developed by Molecular Imprints, the company introduced step-and-flash imprint lithography (S-FIL®), a UV-based process capable of producing sub-10nm features with unmatched fidelity. Building on this foundation, Canon developed the FPA-series NIL platforms, optimized for 300mm wafers and designed to meet the demanding requirements of next-generation memory and logic devices. These systems offer exceptional overlay accuracy, low defectivity, and production-level throughput, supporting both research environments and high-volume manufacturing.
In addition to its tool innovations, Canon Nanotechnologies has pushed the boundaries of materials and process integration. The company has developed a new line of semiconductor-grade imprint resists, engineered for ultra-low contamination and compatibility with leading-edge fab environments. Its advanced inkjet-based dispensing technology enables sub-picoliter drop sizes with extreme precision, ensuring uniform patterning while minimizing material waste and cost. Combined with innovations in alignment, process control, and defect mitigation, these advancements position Canon Nanotechnologies as a leader in scalable, next-generation lithography solutions.